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Hewlett Packard 16GB 1 x 16 GB DDR5 UDIMM 4800 MHz NECC memory module Weight___1.27 kg 8 cm (7") Qualcomm Snapdragon 8 cm (7") Qualcomm Snapdragon 2 GB Wi Fi 5 (802 SATA III Supported storage drive types HDD & SSD Graphics HDCP Yes Maximum resolution 4096 x 2160 pixels Internal I O RGB LED pin header Yes Serial port headers 1 TPM connector Yes 12V power connector Yes Number of chassis fan connectors 3 CPU fan connector Yes ATX Power connector (24 pin) Yes Front panel connector Yes Front panel audio connector Yes S PDIF out connector Yes Number of SATA III connectors 4 USB 3 16GB DDR5 (1x16GB) 4800 UDIMM NECC Memory memory module Features ECC No Memory clock speed 4800 MHz Internal memory type DDR5 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Weight & dimensions Weight 12
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